precision semiconductor packaged mold/mould parts

precision semiconductor packaged mold/mould parts


1.grinding/edm precision within 0.001/0.002mm
2. seven years' experience
3. ISO9001:2000
4.with customers of TE,Kyocera,Sumitomo,JST,etc
5.all machines and materials are imported,material certification can be
provided
6.All parts are strictly inspected before
delivery

precision semiconductor packaged mold/mould parts